PROGRESS: Completed Project	PROJECT REF: NA
PROJECT TITLE: Advanced Material for I.C. and Microelectronic Wirebonder
PROJECT DESCRIPTION: Advanced Material for I.C. and Microelectronic Wirebonder Substantially Improve Performances for Ultrasonic Wirebonding of Microelectronic Packaging The piezoelectric ceramic rings in an ultrasonic bonding transducer may have many vibration modes that will couple to one another. This will increase the bond width and drain energy into unwanted vibration modes due to excitation of harmonics and mode coupling. By using ceramic/ polymer composites, mode coupling can be greatly minimized and pure axial mode vibration can be attained in the desired frequency range. By using composite rings instead of pure ceramic rings, broadband transducers with lower values of mechanical quality factor (Q) can be made, thereby widening and stabilizing the operation of the bonding machine.
FOCUS AREA(S): Opto Electronics
KEYWORDS: I.C., Microelectronic Wirebonder
MODE OF COLLABORATION: any
STATUS PATENT: Granted	PATENT NO: US190497B1
ORGANIZATION: Department of Applied Physics
CONTACT PERSON: Prof C L Choy	EMAIL: scclchoy@polyu.edu.hk
TEL: (852)-2766-5696	FAX: (852)-2766-5697
WEBSITE: http://www.ife.polyu.edu.hk/template_areas.htm	DATE: 26/01/2005