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PROGRESS: Completed Project |
PROJECT REF: PA057 |
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PROJECT TITLE: Polysilicon Devices
and a Method for Fabrication Thereof |
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PROJECT DESCRIPTION: Thin film
transistors (TFTs) fabricated on polycrystalline silicon (polysilicon) have gained much attention in flat panel displays such
as active matrix liquid crystal displays (LCDs) and in static random
access memory (SRAM) units. In comparison with thick film devices
TFT devices made with a thin film have the advantages of lower grain
boundary trap density, higher mobility, and higher on-state current.
It is desirable to make the thin film transistor as thin as possible
in order to provide a high supply current in the on-state. The
invention relates to novel designs of semiconductor devices and to a
method for their fabrication. A novel thin film transistor device,
comprising source and drain regions formed of doped polysilicon and
interconnected by a polysilicon channel region are invented. Such a
transistor having advantages of both conventional thin and thick
film devices including high drive current and low leakage current in
the off state. The fabrication method for this transistor may also
be adapted to manufacture other novel semiconductor devices
including semiconductor capacitance devices, EEPROM devices, and
conductivity modulated TFTs. Potential Applications: - Display
technology - SRAM memory applications - Semiconductor devices
including semiconductor capacitance devices, EEPROM devices, and
conductivity modulated TFTs Advantages over Present Technologies: 1.
Low leakage current and high on-state current 2. No impact
ionization and high trapped charge density problem 3. Electric field
at the channel or drain junction are reduced 4. The grain boundary
trapped charges are reduced 5. Higher mobility |
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FOCUS AREA(S): Integrated Circuit
Design, Display Technologies |
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KEYWORDS: polysilicon device,
fabrication, SRAM memory application, semiconductor device,
capacitance device, |
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MODE OF COLLABORATION: Technology
Licensing, Further R&D Collaboration |
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STATUS PATENT: Granted |
PATENT NO: US5982004 |
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ORGANIZATION: Hong Kong University
of Science and Technology R and D Corporation Limited |
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CONTACT PERSON: Shirley Woo |
EMAIL: cawoosw@ust.hk |
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TEL: (852)-23587918 |
FAX: (852)-23582751 |
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WEBSITE: http://rdc.ust.hk/ |
DATE: 29/12/2004 |